Cep telefonununda kullanılan terimler (1 Viewer)

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Cep telefonunda duydugumuz ama karşılığını bilmediğimiz terimler
Elektronik bilgisi
1G : 1Mobil Telefonda St Generation.
2G : Mobil Telefonda Nd Üretimi.
3G : 3 Rd Mobil Telefon Nesil.
4G : 4 Th Mobil Telefon Nesil.
AC : Alternatif Akım .
BGA : Bilye Izgara Dizisi.
BSI : Pil Durumu Göstergesi.
CDMA : Kod Bölümü Çoklu Erişim.
CPU : Merkezi İşlem Birimi.
DCT : Dijital Çekirdek Teknolojisi.
DC : Doğru Akım.
GSM : Mobil İletişim için Küresel Sistem.
IMEI : Uluslararası Mobil Cihaz Kimliği.
IC : Entegre Devre.
LED : Işık Yayan Diyot.
PDA : Kişisel Dijital Asistan.
PFO : Güç Frekansı Osilatörü.
PCB : Baskılı Devre Kartı .
RAM : Rasgele Erişim Belleği.
RF : Radyo Frekansı.
ROM : Salt Okunur Bellek.
RTC : Gerçek Zamanlı Saat.
RX : Alıcı / Alıcı (Alıcı Bölüm).
SMD : Yüzeye Monte Cihazı.
TX : İletim (İletim Bölümü).
UEM : Evrensel Enerji Yöneticisi.
VCO : Gerilim Kontrollü Osilatör.

PBL = Primary Boot Loader
SBL = Secondary Boot Loader
RPM = Resource and Power Management
TZ = Trust Zone
HDLC = High-level Data Link Control
MSM = Mobile Station Modem
DMSS = Dual-Mode Subscriber Station (QDL mode)
QDL = Qualcomm Download
QHSUSB_DLOAD = Qualcomm High Speed USB Download
EhostDL = Emergency Host Download (Streaming Download Protocol)
DCN = Document Control Number, used by Qualcomm to track their thousands of documents

AMON ARM9 Monitor
AMSS = Advanced Mobile Subscriber Software
APPSBL = Applications Processor Secondary Boot Loader
CE = Crypto Engine
DBL = Device Boot Loader
EBI = External Bus Interface
EFI = Extensible Firmware Interface
ETM = Embedded Trace Macrocell
FEC = Forward Error Correction
IMEM = Internal Memory
OSBL = Operating System Boot Loader
REX = Real-Time Executive (RTOS)
RUU = Remote Update Utility
SD3 = Security Domain 3
SMC = Security Mode Control (module)
SMEM = Shared Memory
SMSM = Shared Memory State Machine
TAP = Test Access Port
TSIF = Transport Stream Interface
LK = Little Kernel (bootloader)
RPM = Resource Power Management

QFUSEs (QFPROM) (register map) = (Qualcomm incorporated) reserved One-Time-Programmable (OTP aka PROM) memory region (src)
(USB) VID/PID = Vendor/Product ID
OEM = Original equipment manufacturer (like Samsung. LG, HTC, etc.)
SoC = Systems on a Chip
QDSP = Qualcomm DSP
QSD = Qualcomm Snapdragon SoCs
APQ = Application Processor Qualcomm (refers to an SoC that does not have an integrated modem (src))
MDM (Gobi) = Multi-mode modem (src) // Gobi - ????? "?? Snapdragon"
HDLC = High-Level Data Link Control (bit-oriented code-transparent synchronous data link layer protocol developed by the International Organization for Standardization (ISO) (src)
QRD = Qualcomm Reference Design (src) ( && "to work with Windows Phone will be made available starting with Snapdragon 400 (8x26, 8926, 8x28, 8928)and Snapdragon 200 (8x12, 8x10) processors)
QDART = Qualcomm Development Acceleration Resource Toolkit
XTTs = extensible test tree files
QMSL = Qualcomm Manufacturing Support Library
DMSS = Dual-Mode Subscriber Station
SURF = Subscriber Unit Reference Design
QRCT = Qualcomm Radio Control Tool
QSPR = Qualcomm Sequence Profiling Resource
SPC = Service Provider Code (normally "000000")
FTM = Factory Test Mode
GPIO = General-purpose input/output
Krait (CPU) = (name) (wiki) - ("Cortex-A15")ARM-based CPU included in Qualcomm Snapdragon S4 and Snapdragon 400/600/800 (Krait 200, Krait 300, Krait 400 and Krait 450) System on chips.

CPU = Central Processing Unit
Snapdragon = (name) - family of mobile systems on a chip (SoC) by Qualcomm (wiki)
eMMC = Embedded Multimedia Card
QFIT = Qualcomm Flash Image Tool
FW = FirmWare (wiki)
EPROM = Erasable Programmable Read Only Memory (ROM) (wiki)
FLCB = Fast Low Current Boot ("Dead battery charging"-mode; USB can enumerate as general device until SBL comes up)
QPST = Qualcomm Product Support Tool (official tool for management Qualcomm based devices)
QXDM = Qualcomm eXtensible Diagnostic Monitor (official tool for diagnostic Qualcomm based devices)

Abbreviations in Electrical & Electronics Engineering
16QAM (16-state quadrature amplitude modulation)
64QAM (64-state quadrature amplitude modulation)
8DPSK (8-state differential phase shift keying)
A (Ampere, Amp)
A/D (Analog to Digital)
AC (Alternating current)
AC/DC (Alternating current or direct current)
ADC (Analog to digital converter)
AES Advanced Encryption Standard
AFC (Automatic Flow Controller)
AFC (Automatic Frequency Control)
AFT (Automatic fine tunung)
AGC (Automatic gain control)
AGPS (Assisted (or Aided) GPS)
AI (Analog Input)
AMOLED (Active-Matrix Organic Light-Emitting Diode)
ANSI (the U.S. American National Standards Institute)
AO (Analog Output)
AoA (Angle of arrival)
AP (Access Point)
APFC (Active Power Factor Correction)
API (Application Programming Interface)
ARM (Advanced Reduced instruction set computing Machine)
ASP (Application Service Provider)
AT ( AT Attachment)
ATAPI (AT Attachment Packet Interface)
AV (Audio/video)
AVDD (Analog Power)
BER (Bit error rate)
BGA (Ball Grid Array)
BiCMOS (Bidirectional CMOS)
BLE (Bluetooth Low Energy)
BOM (Bill Of Materials)
CA (Conditional Access)
CAD (Computer-Aided Design)
CAM (Conditional Access Module)
CAPAD (Capacitors Non Polarized Axial Diameter Horizontal Mounting)
CAPADV (Capacitors Non Polarized Axial Diameter Vertical Mounting)
CAPAE (Capacitor Aluminum Electrolytic)
CAPAR (Capacitors Non Polarized Axial Rectangular)
CAPARV (Capacitors Non Polarized Axial Rect. Vertical Mounting)
CAPC (Capacitor Chip Non-polarized)
CAPCAF (Capacitor Chip Array Flat)
CAPCAV (Capacitor Chip Array Concave)
CAPCP (Capacitor Chip Polarized)
CAPCWR (Capacitor Chip Wire Rectangle)
CAPM (Capacitor Molded Non-polarized)
CAPMP (Capacitor Molded Polarized)
CAPPA (Capacitors Polarized Axial Diameter Horizontal Mounting)
CAPPRD Capacitors Polarized Radial Diameter
CAPRB Capacitors Non Polarized Radial Disk Button Vertical
CAPRD (Capacitors Non Polarized Radial Diameter)
CAPRR Capacitors Non Polarized Radial Rectangular Vertical
CAS (Conditional Access System)
CBC (Cipher Block Chaining mode)
CC (Cable Card)
CCIPCA (Candid CovarianceFree Incremental Principal Component Analysis)
CFP (Ceramic Flat Package)
CI (Common Interface protocol)
CIS (Component Information System)
CLK (Clock)
CLKOUT (Clock Output)
CM (Multimedia Codec Manager)
CMOS (Complementary Metal – Oxide Semiconductor)
CQFP (Ceramic Quad Flat Packages)
CS (Chip Select)
CSA (Common Scrambling Algorithm)
CSL (Coordinated Sample Listing)
CTE (Coefficient of Thermal Expansion)
CVBS (Color Video Blanking and Sync)
D/A (Digital to Analog)
DAC (Digital to Analog Converter)
DBS (Dual-band simultaneous)
DDR (Double Data RAM)
DDR (Double Data Rate)
DES (Data Encryption Standard)
DFHP (Device-Free Human Presence)
DFN (Dual Flat No-lead)
DI (Digital Input)
DIOAD (Diodes Axial Diameter Horizontal)
DIOADV (Diodes Axial Diameter Vertical)
DIOC (Diode Chip)
DIOM (Diode Molded)
DIOMELF (Diode metal electrode leadless face melf)
DIOSC (Diode Side Concave)
DIP (Dual-in-Line Package)
DIPS (Dual-In-Line Sockets)
DK (Development Kit)
DMA (Direct Memory Access)
DNC (Do Not Connect)
DO (Digital Output)
DRAM (Dynamic Random Access Memory)
DRM (Digital Rights Management)
DSL (Digital Subscriber Line)
DSP (Digital signal processor)
DTCP-IP (Digital Transmission Content Protection over Internet Protocol)
DTE (Data Terminal Equipment)
DTV (Digital TeleVision)
DUT (Device Under Test)
DVB (Digital Video Broadcasting)
DVB-C (Digital Video Broadcasting – Cable)
DVB-S (Digital Video Broadcasting – Satellite)
DVB-S2 (Digital Video Broadcasting – Satellite Second Generation)
DVB-T (Digital Video Broadcasting – Terrestrial)
DVB-T2 (Digital Video Broadcasting – Second Generation Terrestrial)
DVDD (Digital Power)
E2LP (Embedded Engineering Learning Platform)
ECAD (Electronic Computer-Aided Design)
ECB (Electronic Codebook mode)
ECM (Entitlement Control Management)
ECO (Engineering change orders)
EDA (Electronic Design Automation)
EDR (Enhanced data rate)
EGNOS (European Geostationary Navigation Overlay Service)
EIA (Electronic Industries Alliance)
Electrolytic Ni /Au (Electrolytic Nickel / Gold)
EMI (Electromagnetic interference)
EMM (Entitlement Management Message)
eMMC (Embedded Multimedia Card)
ENIG (Electroless Nickel-Immersion Gold)
ENIP (Electroless Nickel-Immersion Palladium)
ESD (Electro-Static Discharge)
ESR (Equivalent Series Resistance)
ETH (Ethernet)
ETSI (European Telecommunications Standards Institute)
EVM (Error Vector Magnitude)
EVM (EValuation Module)
FIFO (First In First Out)
FMC (FPGA Mezzanine Card)
FPGA (Field-Programmable Gate Array)
FUSM (Fuse Molded)
GDOP (Geometric Dilution of Precision)
GLONASS (Global Navigation Satellite System)
GND (Ground)
GNSS (Global Navigation Satellite System)
GPIO (General Purpose Input Output)
GPS (Global Positioning System)
GUI (Graphic User Interface)
HAL (Hardware Abstraction Layer)
HASL (Hot Air Solder Level)
HD (High Definition)
HDMI (High-Definition Multimedia Interface)
HDR (Header)
HDRRA (Header Right Angle)
HDRV (Header Vertical)
HDTV (High Definition TV)
HPC (High Pin Count)
HS (High Speed)
HSDPA (High Speed Downlink Packet Access)
HSIC (High Speed Inter Chip)
HSUPA (High Speed Uplink Packet Access)
I/O (Input Output)
I2C (Inter-Integrated Circuit)
I2S (Inter-IC Sound)
IC (Integrated Cicuit)
IDE (Integrated Drive Electronics)
IEEE (Institute of Electrical and Electronics Engineers)
Imm Ag (Immersion Silver)
Imm Sn (Immersion Tin)
INDAD (Inductor Axial Diameter Horizontal Mounting)
INDADV (Inductor Axial Diameter Vertical Mounting)
INDC (Inductor Chip)
INDCAF (Inductor Chip Array Flat)
INDCAV (Inductor Chip Array Concave)
INDM (Inductor Molded)
INDP (Inductor Precision Wire Wound)
INDRD (Inductors Radial Diameter)
IoE (Internet of Everything)
IoT (Internet of Things)
IP (Intellectual Property)
IP (Internet Protocol)
IPC (Interconnecting and packaging electronic Circuit)
IR (Infra Red)
ISP (Internet service provider)
JESD (JEDEC standards)
JTAG (Joint Test Action Group)
JUMP (Jumper)
kbps (kilobits per second)
LCC (Quad Leadless Ceramic Chip Carrier)
LCCS (Quad Leadless Ceramic Chip Carrier)
LCD (Liquid-crystal display)
LCM (Lighting Connectivity Module)
LED (Light-emiting diode)
LEDM (LED Molded)
LEDSC (LED Side Concave)
LGA (Land Grid Array)
LLC (Leadless Chip Carrier)
LNA (Low Noise Amplifier)
LPC (Low Pin Count)
LPCM (Linear pulse-code modulation)
LPRF (Low Power RF)
LTE (Long-Term Evolution)
M2M (Machine to Machine)
MCAD (Mechanical Computer-Aided Design)
MDIO (Management Data Input Output)
MIB (Management Information Base)
MICTOS (MICronas TV Operating System)
MII (Media Indenpendet Interface)
MISO (Master Input Slave Output)
MMC (MultiMediaCard)
MMP (MultiMedia Player)
MMU (Memory Management Unit)
MOSI (Master Output Slave Input)
MPEG (Motion Picture Experts Group)
MRDY (Master Ready)
MSD (Mass Storage Device)
MSD (Moisture sensitive device)
MSL (Moisture Sensitivity Level)
MTSAT (Multifunctional Transport Satellites)
N/A (Not applicable)
NA (Network Analyzer)
Nagra PRM (Nagra Media Persistent Rights Management)
NC (No Connection)
NIM (Network Interface Module)
NM (Not Mounted)
NMEA (National Marine Electronics Association)
NPTH (Non Plated Through Hole)
NTSC (National Television System Committee)
OD (Open Drain)
OD (Outside Diameter)
OEM (Original Equipment Manufacturer)
OMAC (One-key Message Authentication Code)
OS (Operating System)
OSC (Oscillator)
OSCCC (Oscillator Corner Concave)
OSCJ (Oscillator J-Lead)
OSCL (Oscillator L-Bend Lead)
OSCSC (Oscillator Side Concave)
OSP (Organic Solderability Preservative)
OTG (On-The-Go)
PA (Power amplifier)
PADS (Personal Automated Design System)
PAL (Phase Alternating Line)
PAL (Programmable Array Logic)
PATA (Parallel ATA)
PBL (Primary Boot Load)
PCB (Printed Circuit Board)
PCMCIA (Personal Computer Memory Card International Association)
PDET (Power detector)
PGA (Pin Grid Array)
PID (Packet Identifier)
PIR (Passive Infrared Sensors)
PLCC (Plastic Leaded Chip Carrier)
PLCCS (Plastic Leaded Chip Carrier Socket Square)
PM (Power management)
PMIC (Power management integrated circuit)
PQFN (Pull-back Quad Flat No-lead)
PS (Power Supply)
PSON (Pull-back Small Outline No-lead)
PTH (Plated Through Hole)
PVR (Personal video recorder)
PWM (Pulse Width Modulation)
PWR (Power)
QFN (Quad Flat No-lead)
QFP (Quad Flat Package)
QZSS (Quasi-Zenith Satellite System)
RAM (Random-Access Memory)
RAM (Read-Only Memory)
RCA (Radio Corporation of America)
RDBS (Radio Broadcast Data System)
RDS (Radio Data System)
RESAD (Resistor Axial Diameter Horizontal Mounting)
RESADV (Resistor Axial Diameter Vertical Mounting )
RESAR (Resistor Axial Rectangular Horizontal Mounting)
RESC (Resistor Chip)
RESCAF (Resistor Chip Array Flat)
RESCAXE (Resistor Chip Array Convex E-Version (Even Pin Size))
RESCAXS (Resistor Chip Array Convex S-Version (Side Pins Diff))
RESM (Resistor Molded)
RESMELF (Resistor MELF)
RFI (Radio Frequency Interference)
RGMII (Reduced Gigabit Ethernet Media Independent Interface)
RH (Relative humidity)
RISC (Reduced Instruction Set Computer)
RoHS (Restriction of Hazardous Substances)
RSSI (Received Signal Strength Indicator)
RTC (Real Time Clock)
RTOS (Real-Time Operating System)
S2E (Serial-to-Ethernet)
SATA (Serial ATA)
SAW (Surface Acoustic Wave filter)
SBAS (Satellite Based Augmentation System)
SC (Smart Card)
SCL (System Control Layer)
SCTE Society of Cable Telecommunications Engineers
SD (Secure Digital)
SD (Standard definition)
SDRAM (Synchronous Dynamic Random-Access Memory)
SDT (Schematic Design Tools)
SDTV (Standard Definition Television)
SECAM (Séquentiel Couleur Avec Mémoire (French Color TV Standard))
SenML (Sensor Markup Language)
SFS (Streaming File System)
SIM (Subscriber Identification Module)
SIP (Single-In-Line Package)
SMSC (Standard Microsystems Corporation)
SMT (Surface mount technology)
SnPb (Tin-Lead (for solder))
SoC (System on Chip)
SOD (Small Outline Diode)
SODFL (Small Outline Diode Flat Lead)
SOIC (Small Outline Integrated Circuit)
SOJ (Small Outline IC J-Leaded)
SON (Small Outline No-lead)
SOP (Small Outline Package)
SOTFL (Small Outline Transistor Flat Lead)
SPI (Serial Peripheral Interface)
SQFP (Shrink Quad Flat Packages)
SRDY (Slave Ready)
SRO (Solder resistant opening)
SSOP (Shrink Small Outline Package)
SSR (Solid State Relay)
SSS (Selective Solder Strip)
SSTL (Stub Series Terminated Logic)
STB (Set Top Box)
TBD (To Be Determined)
TCP (Transmission Control Protocol)
TCP/IP (Transmission Control Protocol/Internet Protocol)
TCXO (Temperature-Compensated Crystal Oscillator)
TDES (Triple Data Encryption Standard)
TI (Texas Instruments)
TP (Test Point)
TQFP (Thin Quad Flat Package)
TRNG (True Random Number Generator)
TS Transport Stream
TS (Transport Stream)
TSOP (Thin Small Outline Package)
TSQFP (Thin Shrink Quad Flat Packages)
TSSOP (Thin Shrink Small Outline Package)
TTFF (Time to First Fix)
TTSC (Telit Technical Support Centre)
UART (Universal Asynchronous Receiver/Transmitter)
ULPI (Utmi+ Low Pin Interface)
UMTS (Universal Mobile Telecommunication System)
UPnP (Universal Plug and Play)
USB (Universal Serial Bus)
VBATT (Battery Power Supply)
VGA (Video Graphics Array)
VNA (Vector Network Analyzer)
VSWR (Voltage Standing Wave Ratio)
WAAS (Wide Area Augmentation System)
WAN (Wide Area Networks)
WCDMA (Wideband Code Division Multiple Access)
Wi-Fi (Wireless Internet Free Internet)
WLAN (Wireless Local Area Network)
WLPSP Wafer Level Pico Scale Package
WPS (Wi-Fi Protected Setup)
WSI (WLAN to Serial interface)
xSP (Hosted Service Provider)
XTAL (Crystal)
Z (Impedance)
ZIF (Zero Insertion Force)

Abbreviations in Electrical & Electronics Engineering
16QAM (16-state quadrature amplitude modulation)
64QAM (64-state quadrature amplitude modulation)
8DPSK (8-state differential phase shift keying)
A (Ampere, Amp)
A/D (Analog to Digital)
AC (Alternating current)
AC/DC (Alternating current or direct current)
ADC (Analog to digital converter)
AES Advanced Encryption Standard
AFC (Automatic Flow Controller)
AFC (Automatic Frequency Control)
AFT (Automatic fine tunung)
AGC (Automatic gain control)
AGPS (Assisted (or Aided) GPS)
AI (Analog Input)
AMOLED (Active-Matrix Organic Light-Emitting Diode)
ANSI (the U.S. American National Standards Institute)
AO (Analog Output)
AoA (Angle of arrival)
AP (Access Point)
APFC (Active Power Factor Correction)
API (Application Programming Interface)
ARM (Advanced Reduced instruction set computing Machine)
ASP (Application Service Provider)
AT ( AT Attachment)
ATAPI (AT Attachment Packet Interface)
AV (Audio/video)
AVDD (Analog Power)
BER (Bit error rate)
BGA (Ball Grid Array)
BiCMOS (Bidirectional CMOS)
BLE (Bluetooth Low Energy)
BOM (Bill Of Materials)
CA (Conditional Access)
CAD (Computer-Aided Design)
CAM (Conditional Access Module)
CAPAD (Capacitors Non Polarized Axial Diameter Horizontal Mounting)
CAPADV (Capacitors Non Polarized Axial Diameter Vertical Mounting)
CAPAE (Capacitor Aluminum Electrolytic)
CAPAR (Capacitors Non Polarized Axial Rectangular)
CAPARV (Capacitors Non Polarized Axial Rect. Vertical Mounting)
CAPC (Capacitor Chip Non-polarized)
CAPCAF (Capacitor Chip Array Flat)
CAPCAV (Capacitor Chip Array Concave)
CAPCP (Capacitor Chip Polarized)
CAPCWR (Capacitor Chip Wire Rectangle)
CAPM (Capacitor Molded Non-polarized)
CAPMP (Capacitor Molded Polarized)
CAPPA (Capacitors Polarized Axial Diameter Horizontal Mounting)
CAPPRD Capacitors Polarized Radial Diameter
CAPRB Capacitors Non Polarized Radial Disk Button Vertical
CAPRD (Capacitors Non Polarized Radial Diameter)
CAPRR Capacitors Non Polarized Radial Rectangular Vertical
CAS (Conditional Access System)
CBC (Cipher Block Chaining mode)
CC (Cable Card)
CCIPCA (Candid CovarianceFree Incremental Principal Component Analysis)
CFP (Ceramic Flat Package)
CI (Common Interface protocol)
CIS (Component Information System)
CLK (Clock)
CLKOUT (Clock Output)
CM (Multimedia Codec Manager)
CMOS (Complementary Metal – Oxide Semiconductor)
CQFP (Ceramic Quad Flat Packages)
CS (Chip Select)
CSA (Common Scrambling Algorithm)
CSL (Coordinated Sample Listing)
CTE (Coefficient of Thermal Expansion)
CVBS (Color Video Blanking and Sync)
D/A (Digital to Analog)
DAC (Digital to Analog Converter)
DBS (Dual-band simultaneous)
DDR (Double Data RAM)
DDR (Double Data Rate)
DES (Data Encryption Standard)
DFHP (Device-Free Human Presence)
DFN (Dual Flat No-lead)
DI (Digital Input)
DIOAD (Diodes Axial Diameter Horizontal)
DIOADV (Diodes Axial Diameter Vertical)
DIOC (Diode Chip)
DIOM (Diode Molded)
DIOMELF (Diode metal electrode leadless face melf)
DIOSC (Diode Side Concave)
DIP (Dual-in-Line Package)
DIPS (Dual-In-Line Sockets)
DK (Development Kit)
DMA (Direct Memory Access)
DNC (Do Not Connect)
DO (Digital Output)
DRAM (Dynamic Random Access Memory)
DRM (Digital Rights Management)
DSL (Digital Subscriber Line)
DSP (Digital signal processor)
DTCP-IP (Digital Transmission Content Protection over Internet Protocol)
DTE (Data Terminal Equipment)
DTV (Digital TeleVision)
DUT (Device Under Test)
DVB (Digital Video Broadcasting)
DVB-C (Digital Video Broadcasting – Cable)
DVB-S (Digital Video Broadcasting – Satellite)
DVB-S2 (Digital Video Broadcasting – Satellite Second Generation)
DVB-T (Digital Video Broadcasting – Terrestrial)
DVB-T2 (Digital Video Broadcasting – Second Generation Terrestrial)
DVDD (Digital Power)
E2LP (Embedded Engineering Learning Platform)
ECAD (Electronic Computer-Aided Design)
ECB (Electronic Codebook mode)
ECM (Entitlement Control Management)
ECO (Engineering change orders)
EDA (Electronic Design Automation)
EDR (Enhanced data rate)
EGNOS (European Geostationary Navigation Overlay Service)
EIA (Electronic Industries Alliance)
Electrolytic Ni /Au (Electrolytic Nickel / Gold)
EMI (Electromagnetic interference)
EMM (Entitlement Management Message)
eMMC (Embedded Multimedia Card)
ENIG (Electroless Nickel-Immersion Gold)
ENIP (Electroless Nickel-Immersion Palladium)
ESD (Electro-Static Discharge)
ESR (Equivalent Series Resistance)
ETH (Ethernet)
ETSI (European Telecommunications Standards Institute)
EVM (Error Vector Magnitude)
EVM (EValuation Module)
FIFO (First In First Out)
FMC (FPGA Mezzanine Card)
FPGA (Field-Programmable Gate Array)
FUSM (Fuse Molded)
GDOP (Geometric Dilution of Precision)
GLONASS (Global Navigation Satellite System)
GND (Ground)
GNSS (Global Navigation Satellite System)
GPIO (General Purpose Input Output)
GPS (Global Positioning System)
GUI (Graphic User Interface)
HAL (Hardware Abstraction Layer)
HASL (Hot Air Solder Level)
HD (High Definition)
HDMI (High-Definition Multimedia Interface)
HDR (Header)
HDRRA (Header Right Angle)
HDRV (Header Vertical)
HDTV (High Definition TV)
HPC (High Pin Count)
HS (High Speed)
HSDPA (High Speed Downlink Packet Access)
HSIC (High Speed Inter Chip)
HSUPA (High Speed Uplink Packet Access)
I/O (Input Output)
I2C (Inter-Integrated Circuit)
I2S (Inter-IC Sound)
IC (Integrated Cicuit)
IDE (Integrated Drive Electronics)
IEEE (Institute of Electrical and Electronics Engineers)
Imm Ag (Immersion Silver)
Imm Sn (Immersion Tin)
INDAD (Inductor Axial Diameter Horizontal Mounting)
INDADV (Inductor Axial Diameter Vertical Mounting)
INDC (Inductor Chip)
INDCAF (Inductor Chip Array Flat)
INDCAV (Inductor Chip Array Concave)
INDM (Inductor Molded)
INDP (Inductor Precision Wire Wound)
INDRD (Inductors Radial Diameter)
IoE (Internet of Everything)
IoT (Internet of Things)
IP (Intellectual Property)
IP (Internet Protocol)
IPC (Interconnecting and packaging electronic Circuit)
IR (Infra Red)
ISP (Internet service provider)
JESD (JEDEC standards)
JTAG (Joint Test Action Group)
JUMP (Jumper)
kbps (kilobits per second)
LCC (Quad Leadless Ceramic Chip Carrier)
LCCS (Quad Leadless Ceramic Chip Carrier)
LCD (Liquid-crystal display)
LCM (Lighting Connectivity Module)
LED (Light-emiting diode)
LEDM (LED Molded)
LEDSC (LED Side Concave)
LGA (Land Grid Array)
LLC (Leadless Chip Carrier)
LNA (Low Noise Amplifier)
LPC (Low Pin Count)
LPCM (Linear pulse-code modulation)
LPRF (Low Power RF)
LTE (Long-Term Evolution)
M2M (Machine to Machine)
MCAD (Mechanical Computer-Aided Design)
MDIO (Management Data Input Output)
MIB (Management Information Base)
MICTOS (MICronas TV Operating System)
MII (Media Indenpendet Interface)
MISO (Master Input Slave Output)
MMC (MultiMediaCard)
MMP (MultiMedia Player)
MMU (Memory Management Unit)
MOSI (Master Output Slave Input)
MPEG (Motion Picture Experts Group)
MRDY (Master Ready)
MSD (Mass Storage Device)
MSD (Moisture sensitive device)
MSL (Moisture Sensitivity Level)
MTSAT (Multifunctional Transport Satellites)
N/A (Not applicable)
NA (Network Analyzer)
Nagra PRM (Nagra Media Persistent Rights Management)
NC (No Connection)
NIM (Network Interface Module)
NM (Not Mounted)
NMEA (National Marine Electronics Association)
NPTH (Non Plated Through Hole)
NTSC (National Television System Committee)
OD (Open Drain)
OD (Outside Diameter)
OEM (Original Equipment Manufacturer)
OMAC (One-key Message Authentication Code)
OS (Operating System)
OSC (Oscillator)
OSCCC (Oscillator Corner Concave)
OSCJ (Oscillator J-Lead)
OSCL (Oscillator L-Bend Lead)
OSCSC (Oscillator Side Concave)
OSP (Organic Solderability Preservative)
OTG (On-The-Go)
PA (Power amplifier)
PADS (Personal Automated Design System)
PAL (Phase Alternating Line)
PAL (Programmable Array Logic)
PATA (Parallel ATA)
PBL (Primary Boot Load)
PCB (Printed Circuit Board)
PCMCIA (Personal Computer Memory Card International Association)
PDET (Power detector)
PGA (Pin Grid Array)
PID (Packet Identifier)
PIR (Passive Infrared Sensors)
PLCC (Plastic Leaded Chip Carrier)
PLCCS (Plastic Leaded Chip Carrier Socket Square)
PM (Power management)
PMIC (Power management integrated circuit)
PQFN (Pull-back Quad Flat No-lead)
PS (Power Supply)
PSON (Pull-back Small Outline No-lead)
PTH (Plated Through Hole)
PVR (Personal video recorder)
PWM (Pulse Width Modulation)
PWR (Power)
QFN (Quad Flat No-lead)
QFP (Quad Flat Package)
QZSS (Quasi-Zenith Satellite System)
RAM (Random-Access Memory)
RAM (Read-Only Memory)
RCA (Radio Corporation of America)
RDBS (Radio Broadcast Data System)
RDS (Radio Data System)
RESAD (Resistor Axial Diameter Horizontal Mounting)
RESADV (Resistor Axial Diameter Vertical Mounting )
RESAR (Resistor Axial Rectangular Horizontal Mounting)
RESC (Resistor Chip)
RESCAF (Resistor Chip Array Flat)
RESCAXE (Resistor Chip Array Convex E-Version (Even Pin Size))
RESCAXS (Resistor Chip Array Convex S-Version (Side Pins Diff))
RESM (Resistor Molded)
RESMELF (Resistor MELF)
RFI (Radio Frequency Interference)
RGMII (Reduced Gigabit Ethernet Media Independent Interface)
RH (Relative humidity)
RISC (Reduced Instruction Set Computer)
RoHS (Restriction of Hazardous Substances)
RSSI (Received Signal Strength Indicator)
RTC (Real Time Clock)
RTOS (Real-Time Operating System)
S2E (Serial-to-Ethernet)
SATA (Serial ATA)
SAW (Surface Acoustic Wave filter)
SBAS (Satellite Based Augmentation System)
SC (Smart Card)
SCL (System Control Layer)
SCTE Society of Cable Telecommunications Engineers
SD (Secure Digital)
SD (Standard definition)
SDRAM (Synchronous Dynamic Random-Access Memory)
SDT (Schematic Design Tools)
SDTV (Standard Definition Television)
SECAM (Séquentiel Couleur Avec Mémoire (French Color TV Standard))
SenML (Sensor Markup Language)
SFS (Streaming File System)
SIM (Subscriber Identification Module)
SIP (Single-In-Line Package)
SMSC (Standard Microsystems Corporation)
SMT (Surface mount technology)
SnPb (Tin-Lead (for solder))
SoC (System on Chip)
SOD (Small Outline Diode)
SODFL (Small Outline Diode Flat Lead)
SOIC (Small Outline Integrated Circuit)
SOJ (Small Outline IC J-Leaded)
SON (Small Outline No-lead)
SOP (Small Outline Package)
SOTFL (Small Outline Transistor Flat Lead)
SPI (Serial Peripheral Interface)
SQFP (Shrink Quad Flat Packages)
SRDY (Slave Ready)
SRO (Solder resistant opening)
SSOP (Shrink Small Outline Package)
SSR (Solid State Relay)
SSS (Selective Solder Strip)
SSTL (Stub Series Terminated Logic)
STB (Set Top Box)
TBD (To Be Determined)
TCP (Transmission Control Protocol)
TCP/IP (Transmission Control Protocol/Internet Protocol)
TCXO (Temperature-Compensated Crystal Oscillator)
TDES (Triple Data Encryption Standard)
TI (Texas Instruments)
TP (Test Point)
TQFP (Thin Quad Flat Package)
TRNG (True Random Number Generator)
TS Transport Stream
TS (Transport Stream)
TSOP (Thin Small Outline Package)
TSQFP (Thin Shrink Quad Flat Packages)
TSSOP (Thin Shrink Small Outline Package)
TTFF (Time to First Fix)
TTSC (Telit Technical Support Centre)
UART (Universal Asynchronous Receiver/Transmitter)
ULPI (Utmi+ Low Pin Interface)
UMTS (Universal Mobile Telecommunication System)
UPnP (Universal Plug and Play)
USB (Universal Serial Bus)
VBATT (Battery Power Supply)
VGA (Video Graphics Array)
VNA (Vector Network Analyzer)
VSWR (Voltage Standing Wave Ratio)
WAAS (Wide Area Augmentation System)
WAN (Wide Area Networks)
WCDMA (Wideband Code Division Multiple Access)
Wi-Fi (Wireless Internet Free Internet)
WLAN (Wireless Local Area Network)
WLPSP Wafer Level Pico Scale Package
WPS (Wi-Fi Protected Setup)
WSI (WLAN to Serial interface)
xSP (Hosted Service Provider)
XTAL (Crystal)
Z (Impedance)
ZIF (Zero Insertion Force)

amp amplifier
atten attenuator
a anode
b base
c cathode
ca common anode
cc common cathode
comp complement
d drain
dg dual gate
dtr digital transistor (see codebook introduction)
enh enhancement (mode - FETs)
fet field effect transistor
fT transition frequency
GaAsfet Gallium Arsenide field effect transistor
g gate
gnd ground
gp general purpose
hfe small signal current gain
i/p input
Id drain current
Ig gate current
Ir reverse leakage current (diodes)
jfet junction field effect transistor
MAG maximum available gain
max maximum
min minimum
mmic microwave minature integrated circuit
modamp modular amplifier - an mmic amplifier
mosfet metal oxide insulated gate fet
n-ch n-channel fet (any type)
npn npn bipolar transistor
o/p output
p-ch p-channel fet (any type)
pin pin diode
pkg package
pnp pnp bipolar transistor
prot protection, protected (as in mosfet gate)
res resistor
s source
ser series
Si silicon
substr substrate
sw switch or switching
Vce collector - emitter voltage (maximum)
Vcc collector supply voltage
Manufacturer abbreviations
Agi Agilent (was HP)
Fch Fairchild
HP Hewlett-Packard (Now Agilent)
Inf Infineon (was Siemens)
ITT ITT Semiconductors
MC Mini-Circuits
Mot Motorola (now ON Semiconductors)
Nat National Semiconductor
Nec NEC
NJRC New Japan Radio Co
ON ON Semiconductors (was Motorola)
Phi Philips
Roh Rohm
SGS SGS-Thompson
Sie Siemens (now Infineon)
Sil Siliconix (Vishay-Silliconix)
Tem Temic Semiconductors
Tfk Telefunken (Vishay-Telefunken)
 

aslankim34

Allah bize yeter o ne güzel vekildir
Deneyimli Üye
Kayıtlı Kullanıcı
Cep telefonunda duydugumuz ama karşılığını bilmediğimiz terimler
Elektronik bilgisi
1G : 1Mobil Telefonda St Generation.
2G : Mobil Telefonda Nd Üretimi.
3G : 3 Rd Mobil Telefon Nesil.
4G : 4 Th Mobil Telefon Nesil.
AC : Alternatif Akım .
BGA : Bilye Izgara Dizisi.
BSI : Pil Durumu Göstergesi.
CDMA : Kod Bölümü Çoklu Erişim.
CPU : Merkezi İşlem Birimi.
DCT : Dijital Çekirdek Teknolojisi.
DC : Doğru Akım.
GSM : Mobil İletişim için Küresel Sistem.
IMEI : Uluslararası Mobil Cihaz Kimliği.
IC : Entegre Devre.
LED : Işık Yayan Diyot.
PDA : Kişisel Dijital Asistan.
PFO : Güç Frekansı Osilatörü.
PCB : Baskılı Devre Kartı .
RAM : Rasgele Erişim Belleği.
RF : Radyo Frekansı.
ROM : Salt Okunur Bellek.
RTC : Gerçek Zamanlı Saat.
RX : Alıcı / Alıcı (Alıcı Bölüm).
SMD : Yüzeye Monte Cihazı.
TX : İletim (İletim Bölümü).
UEM : Evrensel Enerji Yöneticisi.
VCO : Gerilim Kontrollü Osilatör.

PBL = Primary Boot Loader
SBL = Secondary Boot Loader
RPM = Resource and Power Management
TZ = Trust Zone
HDLC = High-level Data Link Control
MSM = Mobile Station Modem
DMSS = Dual-Mode Subscriber Station (QDL mode)
QDL = Qualcomm Download
QHSUSB_DLOAD = Qualcomm High Speed USB Download
EhostDL = Emergency Host Download (Streaming Download Protocol)
DCN = Document Control Number, used by Qualcomm to track their thousands of documents

AMON ARM9 Monitor
AMSS = Advanced Mobile Subscriber Software
APPSBL = Applications Processor Secondary Boot Loader
CE = Crypto Engine
DBL = Device Boot Loader
EBI = External Bus Interface
EFI = Extensible Firmware Interface
ETM = Embedded Trace Macrocell
FEC = Forward Error Correction
IMEM = Internal Memory
OSBL = Operating System Boot Loader
REX = Real-Time Executive (RTOS)
RUU = Remote Update Utility
SD3 = Security Domain 3
SMC = Security Mode Control (module)
SMEM = Shared Memory
SMSM = Shared Memory State Machine
TAP = Test Access Port
TSIF = Transport Stream Interface
LK = Little Kernel (bootloader)
RPM = Resource Power Management

QFUSEs (QFPROM) (register map) = (Qualcomm incorporated) reserved One-Time-Programmable (OTP aka PROM) memory region (src)
(USB) VID/PID = Vendor/Product ID
OEM = Original equipment manufacturer (like Samsung. LG, HTC, etc.)
SoC = Systems on a Chip
QDSP = Qualcomm DSP
QSD = Qualcomm Snapdragon SoCs
APQ = Application Processor Qualcomm (refers to an SoC that does not have an integrated modem (src))
MDM (Gobi) = Multi-mode modem (src) // Gobi - ????? "?? Snapdragon"
HDLC = High-Level Data Link Control (bit-oriented code-transparent synchronous data link layer protocol developed by the International Organization for Standardization (ISO) (src)
QRD = Qualcomm Reference Design (src) ( && "to work with Windows Phone will be made available starting with Snapdragon 400 (8x26, 8926, 8x28, 8928)and Snapdragon 200 (8x12, 8x10) processors)
QDART = Qualcomm Development Acceleration Resource Toolkit
XTTs = extensible test tree files
QMSL = Qualcomm Manufacturing Support Library
DMSS = Dual-Mode Subscriber Station
SURF = Subscriber Unit Reference Design
QRCT = Qualcomm Radio Control Tool
QSPR = Qualcomm Sequence Profiling Resource
SPC = Service Provider Code (normally "000000")
FTM = Factory Test Mode
GPIO = General-purpose input/output
Krait (CPU) = (name) (wiki) - ("Cortex-A15")ARM-based CPU included in Qualcomm Snapdragon S4 and Snapdragon 400/600/800 (Krait 200, Krait 300, Krait 400 and Krait 450) System on chips.

CPU = Central Processing Unit
Snapdragon = (name) - family of mobile systems on a chip (SoC) by Qualcomm (wiki)
eMMC = Embedded Multimedia Card
QFIT = Qualcomm Flash Image Tool
FW = FirmWare (wiki)
EPROM = Erasable Programmable Read Only Memory (ROM) (wiki)
FLCB = Fast Low Current Boot ("Dead battery charging"-mode; USB can enumerate as general device until SBL comes up)
QPST = Qualcomm Product Support Tool (official tool for management Qualcomm based devices)
QXDM = Qualcomm eXtensible Diagnostic Monitor (official tool for diagnostic Qualcomm based devices)

Abbreviations in Electrical & Electronics Engineering
16QAM (16-state quadrature amplitude modulation)
64QAM (64-state quadrature amplitude modulation)
8DPSK (8-state differential phase shift keying)
A (Ampere, Amp)
A/D (Analog to Digital)
AC (Alternating current)
AC/DC (Alternating current or direct current)
ADC (Analog to digital converter)
AES Advanced Encryption Standard
AFC (Automatic Flow Controller)
AFC (Automatic Frequency Control)
AFT (Automatic fine tunung)
AGC (Automatic gain control)
AGPS (Assisted (or Aided) GPS)
AI (Analog Input)
AMOLED (Active-Matrix Organic Light-Emitting Diode)
ANSI (the U.S. American National Standards Institute)
AO (Analog Output)
AoA (Angle of arrival)
AP (Access Point)
APFC (Active Power Factor Correction)
API (Application Programming Interface)
ARM (Advanced Reduced instruction set computing Machine)
ASP (Application Service Provider)
AT ( AT Attachment)
ATAPI (AT Attachment Packet Interface)
AV (Audio/video)
AVDD (Analog Power)
BER (Bit error rate)
BGA (Ball Grid Array)
BiCMOS (Bidirectional CMOS)
BLE (Bluetooth Low Energy)
BOM (Bill Of Materials)
CA (Conditional Access)
CAD (Computer-Aided Design)
CAM (Conditional Access Module)
CAPAD (Capacitors Non Polarized Axial Diameter Horizontal Mounting)
CAPADV (Capacitors Non Polarized Axial Diameter Vertical Mounting)
CAPAE (Capacitor Aluminum Electrolytic)
CAPAR (Capacitors Non Polarized Axial Rectangular)
CAPARV (Capacitors Non Polarized Axial Rect. Vertical Mounting)
CAPC (Capacitor Chip Non-polarized)
CAPCAF (Capacitor Chip Array Flat)
CAPCAV (Capacitor Chip Array Concave)
CAPCP (Capacitor Chip Polarized)
CAPCWR (Capacitor Chip Wire Rectangle)
CAPM (Capacitor Molded Non-polarized)
CAPMP (Capacitor Molded Polarized)
CAPPA (Capacitors Polarized Axial Diameter Horizontal Mounting)
CAPPRD Capacitors Polarized Radial Diameter
CAPRB Capacitors Non Polarized Radial Disk Button Vertical
CAPRD (Capacitors Non Polarized Radial Diameter)
CAPRR Capacitors Non Polarized Radial Rectangular Vertical
CAS (Conditional Access System)
CBC (Cipher Block Chaining mode)
CC (Cable Card)
CCIPCA (Candid CovarianceFree Incremental Principal Component Analysis)
CFP (Ceramic Flat Package)
CI (Common Interface protocol)
CIS (Component Information System)
CLK (Clock)
CLKOUT (Clock Output)
CM (Multimedia Codec Manager)
CMOS (Complementary Metal – Oxide Semiconductor)
CQFP (Ceramic Quad Flat Packages)
CS (Chip Select)
CSA (Common Scrambling Algorithm)
CSL (Coordinated Sample Listing)
CTE (Coefficient of Thermal Expansion)
CVBS (Color Video Blanking and Sync)
D/A (Digital to Analog)
DAC (Digital to Analog Converter)
DBS (Dual-band simultaneous)
DDR (Double Data RAM)
DDR (Double Data Rate)
DES (Data Encryption Standard)
DFHP (Device-Free Human Presence)
DFN (Dual Flat No-lead)
DI (Digital Input)
DIOAD (Diodes Axial Diameter Horizontal)
DIOADV (Diodes Axial Diameter Vertical)
DIOC (Diode Chip)
DIOM (Diode Molded)
DIOMELF (Diode metal electrode leadless face melf)
DIOSC (Diode Side Concave)
DIP (Dual-in-Line Package)
DIPS (Dual-In-Line Sockets)
DK (Development Kit)
DMA (Direct Memory Access)
DNC (Do Not Connect)
DO (Digital Output)
DRAM (Dynamic Random Access Memory)
DRM (Digital Rights Management)
DSL (Digital Subscriber Line)
DSP (Digital signal processor)
DTCP-IP (Digital Transmission Content Protection over Internet Protocol)
DTE (Data Terminal Equipment)
DTV (Digital TeleVision)
DUT (Device Under Test)
DVB (Digital Video Broadcasting)
DVB-C (Digital Video Broadcasting – Cable)
DVB-S (Digital Video Broadcasting – Satellite)
DVB-S2 (Digital Video Broadcasting – Satellite Second Generation)
DVB-T (Digital Video Broadcasting – Terrestrial)
DVB-T2 (Digital Video Broadcasting – Second Generation Terrestrial)
DVDD (Digital Power)
E2LP (Embedded Engineering Learning Platform)
ECAD (Electronic Computer-Aided Design)
ECB (Electronic Codebook mode)
ECM (Entitlement Control Management)
ECO (Engineering change orders)
EDA (Electronic Design Automation)
EDR (Enhanced data rate)
EGNOS (European Geostationary Navigation Overlay Service)
EIA (Electronic Industries Alliance)
Electrolytic Ni /Au (Electrolytic Nickel / Gold)
EMI (Electromagnetic interference)
EMM (Entitlement Management Message)
eMMC (Embedded Multimedia Card)
ENIG (Electroless Nickel-Immersion Gold)
ENIP (Electroless Nickel-Immersion Palladium)
ESD (Electro-Static Discharge)
ESR (Equivalent Series Resistance)
ETH (Ethernet)
ETSI (European Telecommunications Standards Institute)
EVM (Error Vector Magnitude)
EVM (EValuation Module)
FIFO (First In First Out)
FMC (FPGA Mezzanine Card)
FPGA (Field-Programmable Gate Array)
FUSM (Fuse Molded)
GDOP (Geometric Dilution of Precision)
GLONASS (Global Navigation Satellite System)
GND (Ground)
GNSS (Global Navigation Satellite System)
GPIO (General Purpose Input Output)
GPS (Global Positioning System)
GUI (Graphic User Interface)
HAL (Hardware Abstraction Layer)
HASL (Hot Air Solder Level)
HD (High Definition)
HDMI (High-Definition Multimedia Interface)
HDR (Header)
HDRRA (Header Right Angle)
HDRV (Header Vertical)
HDTV (High Definition TV)
HPC (High Pin Count)
HS (High Speed)
HSDPA (High Speed Downlink Packet Access)
HSIC (High Speed Inter Chip)
HSUPA (High Speed Uplink Packet Access)
I/O (Input Output)
I2C (Inter-Integrated Circuit)
I2S (Inter-IC Sound)
IC (Integrated Cicuit)
IDE (Integrated Drive Electronics)
IEEE (Institute of Electrical and Electronics Engineers)
Imm Ag (Immersion Silver)
Imm Sn (Immersion Tin)
INDAD (Inductor Axial Diameter Horizontal Mounting)
INDADV (Inductor Axial Diameter Vertical Mounting)
INDC (Inductor Chip)
INDCAF (Inductor Chip Array Flat)
INDCAV (Inductor Chip Array Concave)
INDM (Inductor Molded)
INDP (Inductor Precision Wire Wound)
INDRD (Inductors Radial Diameter)
IoE (Internet of Everything)
IoT (Internet of Things)
IP (Intellectual Property)
IP (Internet Protocol)
IPC (Interconnecting and packaging electronic Circuit)
IR (Infra Red)
ISP (Internet service provider)
JESD (JEDEC standards)
JTAG (Joint Test Action Group)
JUMP (Jumper)
kbps (kilobits per second)
LCC (Quad Leadless Ceramic Chip Carrier)
LCCS (Quad Leadless Ceramic Chip Carrier)
LCD (Liquid-crystal display)
LCM (Lighting Connectivity Module)
LED (Light-emiting diode)
LEDM (LED Molded)
LEDSC (LED Side Concave)
LGA (Land Grid Array)
LLC (Leadless Chip Carrier)
LNA (Low Noise Amplifier)
LPC (Low Pin Count)
LPCM (Linear pulse-code modulation)
LPRF (Low Power RF)
LTE (Long-Term Evolution)
M2M (Machine to Machine)
MCAD (Mechanical Computer-Aided Design)
MDIO (Management Data Input Output)
MIB (Management Information Base)
MICTOS (MICronas TV Operating System)
MII (Media Indenpendet Interface)
MISO (Master Input Slave Output)
MMC (MultiMediaCard)
MMP (MultiMedia Player)
MMU (Memory Management Unit)
MOSI (Master Output Slave Input)
MPEG (Motion Picture Experts Group)
MRDY (Master Ready)
MSD (Mass Storage Device)
MSD (Moisture sensitive device)
MSL (Moisture Sensitivity Level)
MTSAT (Multifunctional Transport Satellites)
N/A (Not applicable)
NA (Network Analyzer)
Nagra PRM (Nagra Media Persistent Rights Management)
NC (No Connection)
NIM (Network Interface Module)
NM (Not Mounted)
NMEA (National Marine Electronics Association)
NPTH (Non Plated Through Hole)
NTSC (National Television System Committee)
OD (Open Drain)
OD (Outside Diameter)
OEM (Original Equipment Manufacturer)
OMAC (One-key Message Authentication Code)
OS (Operating System)
OSC (Oscillator)
OSCCC (Oscillator Corner Concave)
OSCJ (Oscillator J-Lead)
OSCL (Oscillator L-Bend Lead)
OSCSC (Oscillator Side Concave)
OSP (Organic Solderability Preservative)
OTG (On-The-Go)
PA (Power amplifier)
PADS (Personal Automated Design System)
PAL (Phase Alternating Line)
PAL (Programmable Array Logic)
PATA (Parallel ATA)
PBL (Primary Boot Load)
PCB (Printed Circuit Board)
PCMCIA (Personal Computer Memory Card International Association)
PDET (Power detector)
PGA (Pin Grid Array)
PID (Packet Identifier)
PIR (Passive Infrared Sensors)
PLCC (Plastic Leaded Chip Carrier)
PLCCS (Plastic Leaded Chip Carrier Socket Square)
PM (Power management)
PMIC (Power management integrated circuit)
PQFN (Pull-back Quad Flat No-lead)
PS (Power Supply)
PSON (Pull-back Small Outline No-lead)
PTH (Plated Through Hole)
PVR (Personal video recorder)
PWM (Pulse Width Modulation)
PWR (Power)
QFN (Quad Flat No-lead)
QFP (Quad Flat Package)
QZSS (Quasi-Zenith Satellite System)
RAM (Random-Access Memory)
RAM (Read-Only Memory)
RCA (Radio Corporation of America)
RDBS (Radio Broadcast Data System)
RDS (Radio Data System)
RESAD (Resistor Axial Diameter Horizontal Mounting)
RESADV (Resistor Axial Diameter Vertical Mounting )
RESAR (Resistor Axial Rectangular Horizontal Mounting)
RESC (Resistor Chip)
RESCAF (Resistor Chip Array Flat)
RESCAXE (Resistor Chip Array Convex E-Version (Even Pin Size))
RESCAXS (Resistor Chip Array Convex S-Version (Side Pins Diff))
RESM (Resistor Molded)
RESMELF (Resistor MELF)
RFI (Radio Frequency Interference)
RGMII (Reduced Gigabit Ethernet Media Independent Interface)
RH (Relative humidity)
RISC (Reduced Instruction Set Computer)
RoHS (Restriction of Hazardous Substances)
RSSI (Received Signal Strength Indicator)
RTC (Real Time Clock)
RTOS (Real-Time Operating System)
S2E (Serial-to-Ethernet)
SATA (Serial ATA)
SAW (Surface Acoustic Wave filter)
SBAS (Satellite Based Augmentation System)
SC (Smart Card)
SCL (System Control Layer)
SCTE Society of Cable Telecommunications Engineers
SD (Secure Digital)
SD (Standard definition)
SDRAM (Synchronous Dynamic Random-Access Memory)
SDT (Schematic Design Tools)
SDTV (Standard Definition Television)
SECAM (Séquentiel Couleur Avec Mémoire (French Color TV Standard))
SenML (Sensor Markup Language)
SFS (Streaming File System)
SIM (Subscriber Identification Module)
SIP (Single-In-Line Package)
SMSC (Standard Microsystems Corporation)
SMT (Surface mount technology)
SnPb (Tin-Lead (for solder))
SoC (System on Chip)
SOD (Small Outline Diode)
SODFL (Small Outline Diode Flat Lead)
SOIC (Small Outline Integrated Circuit)
SOJ (Small Outline IC J-Leaded)
SON (Small Outline No-lead)
SOP (Small Outline Package)
SOTFL (Small Outline Transistor Flat Lead)
SPI (Serial Peripheral Interface)
SQFP (Shrink Quad Flat Packages)
SRDY (Slave Ready)
SRO (Solder resistant opening)
SSOP (Shrink Small Outline Package)
SSR (Solid State Relay)
SSS (Selective Solder Strip)
SSTL (Stub Series Terminated Logic)
STB (Set Top Box)
TBD (To Be Determined)
TCP (Transmission Control Protocol)
TCP/IP (Transmission Control Protocol/Internet Protocol)
TCXO (Temperature-Compensated Crystal Oscillator)
TDES (Triple Data Encryption Standard)
TI (Texas Instruments)
TP (Test Point)
TQFP (Thin Quad Flat Package)
TRNG (True Random Number Generator)
TS Transport Stream
TS (Transport Stream)
TSOP (Thin Small Outline Package)
TSQFP (Thin Shrink Quad Flat Packages)
TSSOP (Thin Shrink Small Outline Package)
TTFF (Time to First Fix)
TTSC (Telit Technical Support Centre)
UART (Universal Asynchronous Receiver/Transmitter)
ULPI (Utmi+ Low Pin Interface)
UMTS (Universal Mobile Telecommunication System)
UPnP (Universal Plug and Play)
USB (Universal Serial Bus)
VBATT (Battery Power Supply)
VGA (Video Graphics Array)
VNA (Vector Network Analyzer)
VSWR (Voltage Standing Wave Ratio)
WAAS (Wide Area Augmentation System)
WAN (Wide Area Networks)
WCDMA (Wideband Code Division Multiple Access)
Wi-Fi (Wireless Internet Free Internet)
WLAN (Wireless Local Area Network)
WLPSP Wafer Level Pico Scale Package
WPS (Wi-Fi Protected Setup)
WSI (WLAN to Serial interface)
xSP (Hosted Service Provider)
XTAL (Crystal)
Z (Impedance)
ZIF (Zero Insertion Force)

Abbreviations in Electrical & Electronics Engineering
16QAM (16-state quadrature amplitude modulation)
64QAM (64-state quadrature amplitude modulation)
8DPSK (8-state differential phase shift keying)
A (Ampere, Amp)
A/D (Analog to Digital)
AC (Alternating current)
AC/DC (Alternating current or direct current)
ADC (Analog to digital converter)
AES Advanced Encryption Standard
AFC (Automatic Flow Controller)
AFC (Automatic Frequency Control)
AFT (Automatic fine tunung)
AGC (Automatic gain control)
AGPS (Assisted (or Aided) GPS)
AI (Analog Input)
AMOLED (Active-Matrix Organic Light-Emitting Diode)
ANSI (the U.S. American National Standards Institute)
AO (Analog Output)
AoA (Angle of arrival)
AP (Access Point)
APFC (Active Power Factor Correction)
API (Application Programming Interface)
ARM (Advanced Reduced instruction set computing Machine)
ASP (Application Service Provider)
AT ( AT Attachment)
ATAPI (AT Attachment Packet Interface)
AV (Audio/video)
AVDD (Analog Power)
BER (Bit error rate)
BGA (Ball Grid Array)
BiCMOS (Bidirectional CMOS)
BLE (Bluetooth Low Energy)
BOM (Bill Of Materials)
CA (Conditional Access)
CAD (Computer-Aided Design)
CAM (Conditional Access Module)
CAPAD (Capacitors Non Polarized Axial Diameter Horizontal Mounting)
CAPADV (Capacitors Non Polarized Axial Diameter Vertical Mounting)
CAPAE (Capacitor Aluminum Electrolytic)
CAPAR (Capacitors Non Polarized Axial Rectangular)
CAPARV (Capacitors Non Polarized Axial Rect. Vertical Mounting)
CAPC (Capacitor Chip Non-polarized)
CAPCAF (Capacitor Chip Array Flat)
CAPCAV (Capacitor Chip Array Concave)
CAPCP (Capacitor Chip Polarized)
CAPCWR (Capacitor Chip Wire Rectangle)
CAPM (Capacitor Molded Non-polarized)
CAPMP (Capacitor Molded Polarized)
CAPPA (Capacitors Polarized Axial Diameter Horizontal Mounting)
CAPPRD Capacitors Polarized Radial Diameter
CAPRB Capacitors Non Polarized Radial Disk Button Vertical
CAPRD (Capacitors Non Polarized Radial Diameter)
CAPRR Capacitors Non Polarized Radial Rectangular Vertical
CAS (Conditional Access System)
CBC (Cipher Block Chaining mode)
CC (Cable Card)
CCIPCA (Candid CovarianceFree Incremental Principal Component Analysis)
CFP (Ceramic Flat Package)
CI (Common Interface protocol)
CIS (Component Information System)
CLK (Clock)
CLKOUT (Clock Output)
CM (Multimedia Codec Manager)
CMOS (Complementary Metal – Oxide Semiconductor)
CQFP (Ceramic Quad Flat Packages)
CS (Chip Select)
CSA (Common Scrambling Algorithm)
CSL (Coordinated Sample Listing)
CTE (Coefficient of Thermal Expansion)
CVBS (Color Video Blanking and Sync)
D/A (Digital to Analog)
DAC (Digital to Analog Converter)
DBS (Dual-band simultaneous)
DDR (Double Data RAM)
DDR (Double Data Rate)
DES (Data Encryption Standard)
DFHP (Device-Free Human Presence)
DFN (Dual Flat No-lead)
DI (Digital Input)
DIOAD (Diodes Axial Diameter Horizontal)
DIOADV (Diodes Axial Diameter Vertical)
DIOC (Diode Chip)
DIOM (Diode Molded)
DIOMELF (Diode metal electrode leadless face melf)
DIOSC (Diode Side Concave)
DIP (Dual-in-Line Package)
DIPS (Dual-In-Line Sockets)
DK (Development Kit)
DMA (Direct Memory Access)
DNC (Do Not Connect)
DO (Digital Output)
DRAM (Dynamic Random Access Memory)
DRM (Digital Rights Management)
DSL (Digital Subscriber Line)
DSP (Digital signal processor)
DTCP-IP (Digital Transmission Content Protection over Internet Protocol)
DTE (Data Terminal Equipment)
DTV (Digital TeleVision)
DUT (Device Under Test)
DVB (Digital Video Broadcasting)
DVB-C (Digital Video Broadcasting – Cable)
DVB-S (Digital Video Broadcasting – Satellite)
DVB-S2 (Digital Video Broadcasting – Satellite Second Generation)
DVB-T (Digital Video Broadcasting – Terrestrial)
DVB-T2 (Digital Video Broadcasting – Second Generation Terrestrial)
DVDD (Digital Power)
E2LP (Embedded Engineering Learning Platform)
ECAD (Electronic Computer-Aided Design)
ECB (Electronic Codebook mode)
ECM (Entitlement Control Management)
ECO (Engineering change orders)
EDA (Electronic Design Automation)
EDR (Enhanced data rate)
EGNOS (European Geostationary Navigation Overlay Service)
EIA (Electronic Industries Alliance)
Electrolytic Ni /Au (Electrolytic Nickel / Gold)
EMI (Electromagnetic interference)
EMM (Entitlement Management Message)
eMMC (Embedded Multimedia Card)
ENIG (Electroless Nickel-Immersion Gold)
ENIP (Electroless Nickel-Immersion Palladium)
ESD (Electro-Static Discharge)
ESR (Equivalent Series Resistance)
ETH (Ethernet)
ETSI (European Telecommunications Standards Institute)
EVM (Error Vector Magnitude)
EVM (EValuation Module)
FIFO (First In First Out)
FMC (FPGA Mezzanine Card)
FPGA (Field-Programmable Gate Array)
FUSM (Fuse Molded)
GDOP (Geometric Dilution of Precision)
GLONASS (Global Navigation Satellite System)
GND (Ground)
GNSS (Global Navigation Satellite System)
GPIO (General Purpose Input Output)
GPS (Global Positioning System)
GUI (Graphic User Interface)
HAL (Hardware Abstraction Layer)
HASL (Hot Air Solder Level)
HD (High Definition)
HDMI (High-Definition Multimedia Interface)
HDR (Header)
HDRRA (Header Right Angle)
HDRV (Header Vertical)
HDTV (High Definition TV)
HPC (High Pin Count)
HS (High Speed)
HSDPA (High Speed Downlink Packet Access)
HSIC (High Speed Inter Chip)
HSUPA (High Speed Uplink Packet Access)
I/O (Input Output)
I2C (Inter-Integrated Circuit)
I2S (Inter-IC Sound)
IC (Integrated Cicuit)
IDE (Integrated Drive Electronics)
IEEE (Institute of Electrical and Electronics Engineers)
Imm Ag (Immersion Silver)
Imm Sn (Immersion Tin)
INDAD (Inductor Axial Diameter Horizontal Mounting)
INDADV (Inductor Axial Diameter Vertical Mounting)
INDC (Inductor Chip)
INDCAF (Inductor Chip Array Flat)
INDCAV (Inductor Chip Array Concave)
INDM (Inductor Molded)
INDP (Inductor Precision Wire Wound)
INDRD (Inductors Radial Diameter)
IoE (Internet of Everything)
IoT (Internet of Things)
IP (Intellectual Property)
IP (Internet Protocol)
IPC (Interconnecting and packaging electronic Circuit)
IR (Infra Red)
ISP (Internet service provider)
JESD (JEDEC standards)
JTAG (Joint Test Action Group)
JUMP (Jumper)
kbps (kilobits per second)
LCC (Quad Leadless Ceramic Chip Carrier)
LCCS (Quad Leadless Ceramic Chip Carrier)
LCD (Liquid-crystal display)
LCM (Lighting Connectivity Module)
LED (Light-emiting diode)
LEDM (LED Molded)
LEDSC (LED Side Concave)
LGA (Land Grid Array)
LLC (Leadless Chip Carrier)
LNA (Low Noise Amplifier)
LPC (Low Pin Count)
LPCM (Linear pulse-code modulation)
LPRF (Low Power RF)
LTE (Long-Term Evolution)
M2M (Machine to Machine)
MCAD (Mechanical Computer-Aided Design)
MDIO (Management Data Input Output)
MIB (Management Information Base)
MICTOS (MICronas TV Operating System)
MII (Media Indenpendet Interface)
MISO (Master Input Slave Output)
MMC (MultiMediaCard)
MMP (MultiMedia Player)
MMU (Memory Management Unit)
MOSI (Master Output Slave Input)
MPEG (Motion Picture Experts Group)
MRDY (Master Ready)
MSD (Mass Storage Device)
MSD (Moisture sensitive device)
MSL (Moisture Sensitivity Level)
MTSAT (Multifunctional Transport Satellites)
N/A (Not applicable)
NA (Network Analyzer)
Nagra PRM (Nagra Media Persistent Rights Management)
NC (No Connection)
NIM (Network Interface Module)
NM (Not Mounted)
NMEA (National Marine Electronics Association)
NPTH (Non Plated Through Hole)
NTSC (National Television System Committee)
OD (Open Drain)
OD (Outside Diameter)
OEM (Original Equipment Manufacturer)
OMAC (One-key Message Authentication Code)
OS (Operating System)
OSC (Oscillator)
OSCCC (Oscillator Corner Concave)
OSCJ (Oscillator J-Lead)
OSCL (Oscillator L-Bend Lead)
OSCSC (Oscillator Side Concave)
OSP (Organic Solderability Preservative)
OTG (On-The-Go)
PA (Power amplifier)
PADS (Personal Automated Design System)
PAL (Phase Alternating Line)
PAL (Programmable Array Logic)
PATA (Parallel ATA)
PBL (Primary Boot Load)
PCB (Printed Circuit Board)
PCMCIA (Personal Computer Memory Card International Association)
PDET (Power detector)
PGA (Pin Grid Array)
PID (Packet Identifier)
PIR (Passive Infrared Sensors)
PLCC (Plastic Leaded Chip Carrier)
PLCCS (Plastic Leaded Chip Carrier Socket Square)
PM (Power management)
PMIC (Power management integrated circuit)
PQFN (Pull-back Quad Flat No-lead)
PS (Power Supply)
PSON (Pull-back Small Outline No-lead)
PTH (Plated Through Hole)
PVR (Personal video recorder)
PWM (Pulse Width Modulation)
PWR (Power)
QFN (Quad Flat No-lead)
QFP (Quad Flat Package)
QZSS (Quasi-Zenith Satellite System)
RAM (Random-Access Memory)
RAM (Read-Only Memory)
RCA (Radio Corporation of America)
RDBS (Radio Broadcast Data System)
RDS (Radio Data System)
RESAD (Resistor Axial Diameter Horizontal Mounting)
RESADV (Resistor Axial Diameter Vertical Mounting )
RESAR (Resistor Axial Rectangular Horizontal Mounting)
RESC (Resistor Chip)
RESCAF (Resistor Chip Array Flat)
RESCAXE (Resistor Chip Array Convex E-Version (Even Pin Size))
RESCAXS (Resistor Chip Array Convex S-Version (Side Pins Diff))
RESM (Resistor Molded)
RESMELF (Resistor MELF)
RFI (Radio Frequency Interference)
RGMII (Reduced Gigabit Ethernet Media Independent Interface)
RH (Relative humidity)
RISC (Reduced Instruction Set Computer)
RoHS (Restriction of Hazardous Substances)
RSSI (Received Signal Strength Indicator)
RTC (Real Time Clock)
RTOS (Real-Time Operating System)
S2E (Serial-to-Ethernet)
SATA (Serial ATA)
SAW (Surface Acoustic Wave filter)
SBAS (Satellite Based Augmentation System)
SC (Smart Card)
SCL (System Control Layer)
SCTE Society of Cable Telecommunications Engineers
SD (Secure Digital)
SD (Standard definition)
SDRAM (Synchronous Dynamic Random-Access Memory)
SDT (Schematic Design Tools)
SDTV (Standard Definition Television)
SECAM (Séquentiel Couleur Avec Mémoire (French Color TV Standard))
SenML (Sensor Markup Language)
SFS (Streaming File System)
SIM (Subscriber Identification Module)
SIP (Single-In-Line Package)
SMSC (Standard Microsystems Corporation)
SMT (Surface mount technology)
SnPb (Tin-Lead (for solder))
SoC (System on Chip)
SOD (Small Outline Diode)
SODFL (Small Outline Diode Flat Lead)
SOIC (Small Outline Integrated Circuit)
SOJ (Small Outline IC J-Leaded)
SON (Small Outline No-lead)
SOP (Small Outline Package)
SOTFL (Small Outline Transistor Flat Lead)
SPI (Serial Peripheral Interface)
SQFP (Shrink Quad Flat Packages)
SRDY (Slave Ready)
SRO (Solder resistant opening)
SSOP (Shrink Small Outline Package)
SSR (Solid State Relay)
SSS (Selective Solder Strip)
SSTL (Stub Series Terminated Logic)
STB (Set Top Box)
TBD (To Be Determined)
TCP (Transmission Control Protocol)
TCP/IP (Transmission Control Protocol/Internet Protocol)
TCXO (Temperature-Compensated Crystal Oscillator)
TDES (Triple Data Encryption Standard)
TI (Texas Instruments)
TP (Test Point)
TQFP (Thin Quad Flat Package)
TRNG (True Random Number Generator)
TS Transport Stream
TS (Transport Stream)
TSOP (Thin Small Outline Package)
TSQFP (Thin Shrink Quad Flat Packages)
TSSOP (Thin Shrink Small Outline Package)
TTFF (Time to First Fix)
TTSC (Telit Technical Support Centre)
UART (Universal Asynchronous Receiver/Transmitter)
ULPI (Utmi+ Low Pin Interface)
UMTS (Universal Mobile Telecommunication System)
UPnP (Universal Plug and Play)
USB (Universal Serial Bus)
VBATT (Battery Power Supply)
VGA (Video Graphics Array)
VNA (Vector Network Analyzer)
VSWR (Voltage Standing Wave Ratio)
WAAS (Wide Area Augmentation System)
WAN (Wide Area Networks)
WCDMA (Wideband Code Division Multiple Access)
Wi-Fi (Wireless Internet Free Internet)
WLAN (Wireless Local Area Network)
WLPSP Wafer Level Pico Scale Package
WPS (Wi-Fi Protected Setup)
WSI (WLAN to Serial interface)
xSP (Hosted Service Provider)
XTAL (Crystal)
Z (Impedance)
ZIF (Zero Insertion Force)

amp amplifier
atten attenuator
a anode
b base
c cathode
ca common anode
cc common cathode
comp complement
d drain
dg dual gate
dtr digital transistor (see codebook introduction)
enh enhancement (mode - FETs)
fet field effect transistor
fT transition frequency
GaAsfet Gallium Arsenide field effect transistor
g gate
gnd ground
gp general purpose
hfe small signal current gain
i/p input
Id drain current
Ig gate current
Ir reverse leakage current (diodes)
jfet junction field effect transistor
MAG maximum available gain
max maximum
min minimum
mmic microwave minature integrated circuit
modamp modular amplifier - an mmic amplifier
mosfet metal oxide insulated gate fet
n-ch n-channel fet (any type)
npn npn bipolar transistor
o/p output
p-ch p-channel fet (any type)
pin pin diode
pkg package
pnp pnp bipolar transistor
prot protection, protected (as in mosfet gate)
res resistor
s source
ser series
Si silicon
substr substrate
sw switch or switching
Vce collector - emitter voltage (maximum)
Vcc collector supply voltage
Manufacturer abbreviations
Agi Agilent (was HP)
Fch Fairchild
HP Hewlett-Packard (Now Agilent)
Inf Infineon (was Siemens)
ITT ITT Semiconductors
MC Mini-Circuits
Mot Motorola (now ON Semiconductors)
Nat National Semiconductor
Nec NEC
NJRC New Japan Radio Co
ON ON Semiconductors (was Motorola)
Phi Philips
Roh Rohm
SGS SGS-Thompson
Sie Siemens (now Infineon)
Sil Siliconix (Vishay-Silliconix)
Tem Temic Semiconductors
Tfk Telefunken (Vishay-Telefunken)
abi kitap yazmışsın bi imzan eksik :unsure:
 
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